What magnetic-flotation-acid leaching flows achieve 99.995% SiO₂ purity?
Achieving ultra-high purity silica (SiO₂) with 99.995% purity typically involves a multi-stage process combining physical and chemical methods. Below is a generalized flow diagram of magnetic separation, flotation, and acid leaching, which are widely used:
1. Magnetic Separation
- Purpose: Remove magnetic impurities such as iron oxides (Fe₂O₃).
- Process:
- Feed raw quartz material into magnetic separators to eliminate ferromagnetic and paramagnetic impurities.
- Use strong magnetic fields (high-gradient separators) to ensure efficient separation.
- Outcome: Reduction of Fe₂O₃ content, preparing the quartz for further refinement.
2. Flotation
- Purpose: Remove non-ferrous impurities like feldspar, mica, and other silicate minerals.
- Process:
- Crush and grind quartz to a certain particle size suitable for flotation.
- Add flotation reagents (collectors, frothers, pH modifiers) to the slurry.
- Use specific reagents (like HF as an activator or fatty acids as collectors) to target feldspar and mica, while keeping silica inert.
- Separate froth (impurity minerals) from quartz particles through controlled flotation techniques.
- Outcome: Removal of silicate-based and non-ferrous impurities.
3. Acid Leaching
- Purpose: Dissolve remaining metallic impurities and achieve high chemical purity.
- Process:
- Treat quartz with strong mineral acids (e.g., HCl, HF, or H₂SO₄).
- Acid concentration, temperature, and duration are optimized for specific impurities (e.g., HF is very effective in dissolving silicates).
- Incorporate multi-stage acid washing to target different types of impurities sequentially.
- Rinse thoroughly with deionized water to ensure removal of residual acids and dissolved impurities.
- Outcome: Substantial elimination of metallic and refractory impurities (e.g., Fe, Al, Ca, Ti).
4. Thermal Treatment (Optional)
- Purpose: Further purification by volatilizing trace impurities not removed by acid leaching.
- Process:
- Heat quartz at high temperatures (up to 800–1000°C) to ensure further enhancement in purity.
- Specialized techniques like chlorination at elevated temperatures may remove residual metallic impurities (e.g., titanium and aluminium).
Quality Control
- Test silica purity using analytical techniques such as ICP-MS (Inductively Coupled Plasma Mass Spectrometry) or XRF (X-ray Fluorescence).
- Ensure final purity reaches ≥99.995% SiO₂ before use in applications like semiconductor manufacturing and optical glass.
Key Considerations
- Process optimization is critical to achieving 99.995% SiO₂ purity.
- Impurity profiles in the raw material vary; some may require additional processes or tailored re-agent mixtures.
- Careful environmental management is necessary due to the use of hazardous chemicals (e.g., HF and HCl).
By combining these techniques, high-purity quartz (HPQ) suitable for advanced technological applications can be achieved. This general workflow can vary depending on the nature of the raw material and specific industrial requirements.
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